Ed Copper Foils pou FPC
Pwodwi Entwodiksyon
FCF, fleksibpapye kwiv se espesyalman devlope ak manifaktire pou endistri a FPC (FCCL). Sa a papye kwiv elektwolitik gen pi bon duktilite, pi ba brutality ak pi bon fòs kale paselòt papye kwivs. An menm tan an, fini an sifas ak rafineman nan papye a kwiv se pi bon ak rezistans a plisman setouPi bon pase pwodwi FOIL menm jan an. Depi sa a se papye kwiv ki baze sou pwosesis la elektwolitik, li pa gen grès, ki fè li pi fasil yo dwe konbine avèk materyèl TPI nan tanperati ki wo.
Ranje dimansyon:
Epesè:9µm～35µm
Pèfòmans
Sifas pwodwi a se nwa oswa wouj, gen pi ba brutality sifas yo.
Aplikasyon
Fleksib kòb kwiv mete Plastifye (FCCL), amann sikwi FPC, ki ap dirije kouvwi kristal fim mens.
Karakteristik:
Segondè dansite, segondè rezistans koube ak bon pèfòmans grave.
Microstructure:
SEM (ki graj bò apre tretman)
SEM (anvan tretman sifas)
SEM (bò klere apre tretman)
Table1- Pèfòmans (GB/T5230-2000 、 IPC-4562-2000):
| Klasifikasyon | Inite | 9μm | 12μm | 18μm | 35μm | |
| Kontni cu | % | ≥99.8 | ||||
| Zòn Weigth | g/m2 | 80 ± 3 | 107 ± 3 | 153 ± 5 | 283 ± 7 | |
| Fòs rupture | RT (23 ℃) | Kg/mm2 | ≥28 | |||
| HT (180 ℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
| Elongasyon | RT (23 ℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
| HT (180 ℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
| Brwayead | Klere (ra) | μm | ≤0.43 | |||
| Mat (RZ) | ≤2.5 | |||||
| Kale fòs | RT (23 ℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| To degrade nan HCΦ (18%-1hr/25 ℃) | % | ≤7.0 | ||||
| Chanjman nan koulè (e-1.0hr/200 ℃) | % | Bon | ||||
| Soude k ap flote 290 ℃ | Sec. | ≥ 20 | ||||
| Aparans (plas ak poud kwiv) | ---- | Okenn | ||||
| Twoub | EA | Zero | ||||
| Tolerans gwosè | Lajè | mm | 0 ~ 2mm | |||
| Longè | mm | ---- | ||||
| Nwayo | Mm/pous | Anndan dyamèt 79mm/3 pous | ||||
Remak: 1. Ka kòb kwiv mete FOIL Pèfòmans Rezistans oksidasyon ak endèks dansite sifas dwe negosye.
2. Index pèfòmans lan sijè a metòd tès nou an.
3. Peryòd garanti bon jan kalite a se 90 jou soti nan dat resi a.
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