ED Copper Foils pou FPC
Entwodiksyon pwodwi
FCF, fleksibpapye kwiv se espesyalman devlope ak manifaktire pou endistri a FPC (FCCL). Foil kwiv elektwolitik sa a gen pi bon duktilite, pi ba brutality ak pi bon fòs kale paselòt papye kwivs. An menm tan an, fini an sifas ak rafineman nan FOIL la kwiv se pi bon ak rezistans nan plisman setoupi bon pase pwodwi papye kwiv menm jan an. Depi papye kwiv sa a baze sou pwosesis elektwolitik la, li pa gen grès, sa ki fè li pi fasil pou konbine avèk materyèl TPI nan tanperati ki wo.
Ranje dimansyon:
Epesè:9µm～35µm
Pèfòmans
Sifas pwodwi a se nwa oswa wouj, gen pi ba sifas brutality.
Aplikasyon
Fleksib Copper Clad Plastifye (FCCL), Fine Circuit FPC, ki ap dirije kristal kouvwi fim mens.
Karakteristik:
Segondè dansite, segondè rezistans koube ak bon pèfòmans grave.
Mikwostrikti:
SEM (bò ki graj apre tretman)
SEM (Anvan Tretman Sifas)
SEM (Shiny Side apre tretman)
Tablo 1- Pèfòmans (GB/T5230-2000、IPC-4562-2000):
| Klasifikasyon | Inite | 9μm | 12μm | 18μm | 35μm | |
| Cu Content | % | ≥99.8 | ||||
| Pwa Zòn | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
| Fòs rupture | RT (23℃) | Kg/mm2 | ≥28 | |||
| HT (180 ℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
| Elongasyon | RT (23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
| HT (180 ℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
| Brutalizasyon | Klere (Ra) | μm | ≤0.43 | |||
| Mat (Rz) | ≤2.5 | |||||
| Peel fòs | RT (23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| To degrade nan HCΦ (18% -1hr / 25 ℃) | % | ≤7.0 | ||||
| Chanjman koulè (E-1.0hr/200℃) | % | Bon | ||||
| Soude k ap flote 290 ℃ | Sek. | ≥20 | ||||
| Aparans (Tach ak poud kwiv) | ---- | Okenn | ||||
| Pinhole | EA | Zewo | ||||
| Tolerans gwosè | Lajè | mm | 0 ~ 2mm | |||
| Longè | mm | ---- | ||||
| Nwayo | Mm/pous | Anndan Dyamèt 79mm/3 pous | ||||
Nòt: 1. FOIL kwiv oksidasyon rezistans pèfòmans ak endèks dansite sifas yo ka negosye.
2. Endèks pèfòmans lan se sijè a metòd tès nou an.
3. Peryòd garanti bon jan kalite a se 90 jou apati dat li resevwa.
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